Bhubaneswar: IIT Bhubaneswar hosted a two- day Semiconductor Manufacturing Primer Workshop in collaboration with SEMI, Electronics Sector Skills Council of India (ESSCI), and India Electronics and Semiconductor Association (IESA), last week.
The event brought together academia, industry, and government stakeholders to deliver hands-on sessions and discussions aimed at bridging the skillgap in semiconductor manufacturing, packaging, and allied domains. With curated modules on topics such as industrial safety for semiconductors, cleanroom practices, vacuum technologies, display systems, and advanced packaging, the workshop was tailored to align with AICTE’s new curriculum electives.
Inaugurating the workshop, Prof. Shreepad Karmalkar, Director of IIT Bhubaneswar, emphasized the strategic responsibility of academic institutions in enabling national self-reliance in semiconductors: “At IIT Bhubaneswar, we are committed to nurturing engineers who not only understand advanced technologies but are also equipped to innovate within them. This course offers students an opportunity to engage with the concepts and skills required for the practice of semiconductor technology – from understanding crystal growth of silicon carbide at 2400°C to exploring device-level concepts like Metal-Oxide-Semicon ductor Field-Effect Transistor (MOSFETs). By combining interdisciplinary theory with hands-on skill-building, it reflects our alignment with the National Education Policy’s emphasis on practical, skill-based learning.”
The workshop also witnessed the presence of Manas Ranjan Panda, Special Secretary, Electronics & IT Department, Government of Odisha, who shared the state’s vision for an integrated semiconductor ecosystem: “Semiconductors are the backbone of modern technology, and Odisha is committed to building a full-stack ecosystem-from chip design and fabrication to advanced packaging and talent development. Institutions like IIT Bhubaneswar are driving this mission through forward-looking curricula and industry-aligned research. With initiatives like the Odisha Chip programme, global partnerships, and faculty upskilling, we aim to bridge the talent gap and position Odisha as a hub for compound semiconductors and advanced packaging.”
Representing the industry and skilldevelopment sector, Dr. Ashwini K. Aggarwal, Chair, Semiconductor Skill Committee at ESSCI, reflected on the need for industry-
